Used to protect LCD interfaces from destructive electromagnetic fields and electrostatic discharges, the LX7207 flip-chip array can eliminate up to 50 discrete components. The 5 x 5 array can support ...
Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback