The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

We may look back at 2001 as the year the age of plastic flip-chip began. After hovering in a seemingly endless holding pattern, flip-chip packaging and assembly of ICs on laminate (plastic) substrates ...

Much has changed in IC packaging technology since the first real-time microfocus X-ray systems entered the inspection market nearly 20 years ago. The trend for high-density packaging is moving from ...

The value of chip-package codesign is well established. Complex parts with high-speed signals put more constraints on the design of both IC and package, and careful design is required to achieve ...