Operating a new device named the Fusion Z-pinch Experiment 3, or FuZE-3, Zap Energy has now achieved plasmas with electron pressures as high as 830 megapascals (MPa), or 1.6 gigapascals (GPa) total, ...

The VAVSEA ice cream maker has a 1.5-quart capacity that’s practical for couples, small families, or anyone who wants fresh dessert without filling the entire freezer. It comes with a double-insulated ...

Valve has formally introduced the Steam Machine as part of its upcoming Steam Hardware lineup, confirming an early-2026 release window. The device sits alongside the new Steam Controller and Steam ...

Valve has announced three new Steam hardware products, which will all be shipping out in early 2026. Next year will see the launch of a new Steam Controller, a Steam Machine for PC gaming, and the ...

Journal Editorial Report: MIT rejects the President’s college ‘compact.’ Editor’s note: In this Future View, students discuss President Trump’s Compact for Academic Excellence in Higher Education.

Journal Editorial Report: MIT rejects the President’s college ‘compact.’ I never thought I’d need to defend the idea that great universities are a national treasure, especially not in America. Our ...

Efficiently integrating multiple axes of motion within limited spatial and mechanical constraints remains a significant challenge for machine designers. Leveraging compact servo drives with real-time ...

Demands sent to nine top schools included pledging to freeze tuition for five years and to commit to strict definitions of gender. By Michael C. Bender The White House on Wednesday sent letters to ...

CASE Construction Equipment will showcase a full lineup of machines for utility crews at The Utility Expo 2025, October 7-9, at booth K277. The display will feature electric models, compact equipment ...

Single-pair Ethernet (SPE) is gaining recognition as a streamlined industrial networking solution that simplifies how components in machine design communicate, power and integrate. Recent insights ...

As semiconductor technologies advance, device structures are becoming increasingly complex. New materials and architectures introduce intricate physical effects requiring accurate modeling to ensure ...